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Product Introduction
The Temperature equalization board module is a high-performance thermal management component designed to uniformly distribute and balance heat across sensitive electronic components. Engineered for modern applications that demand consistent temperature control, this module effectively reduces hotspots, improves overall cooling efficiency, and enhances the long-term reliability of electronic devices.
Whether used in communication equipment, battery packs, power modules, or industrial electronics, the Temperature Equalization Board ensures stable thermal performance by spreading heat evenly across the entire module surface.
Key Features:
Uniform Heat Distribution – Eliminates temperature differences across the board, reducing thermal stress and increasing system stability.
Efficient Heat Conduction – Built with high thermal conductivity materials for quick and effective heat transfer.
Battery Protection – Ideal for lithium-ion battery packs and energy storage systems, balancing temperature during charging/discharging cycles.
Modular & Lightweight Design – Easy to integrate into compact systems without adding bulk.
Compatible with Various Cooling Systems – Works in conjunction with fans, heat sinks, and thermal pads.
Enhanced Equipment Lifespan – Prevents overheating and component degradation over time.
Typical Applications:
EV battery thermal management
Power modules and inverters
Communication base stations
Data centers and servers
Medical and industrial control devices
Product parameters
Specification:Maximum size: 400MMX 400MM
Thickness:1.0 mm (MM) or above
Work quality:Refrigerant
Microstructure:Multilayer fiber capillary structure, regionalized pore size design
Cavity material: oxygen-free copper (C1100/C1020)
External structure: oxygen-free copper (C1100/C1020
characteristic
Low starting temperature; fast heat transfer speed; good temperature averaging performance: large output power: low manufacturing cost; long service life and lighter.
Application scope
Especially suitable for cooling needs in narrow space environments where height space is strictly restricted. Such as laptops, computer workstations and network servers. It is very suitable for working environments where the temperature of the node is high and needs to be cooled quickly in step by step. For example, the heat dissipation of high-power LEDs, the heat dissipation of semiconductor refrigeration wafers and the thermal power generation, the temperature uniform plate, as a heat transfer element, can provide heat dissipation needs in the electronics industry and many other industries.
structure
A completely closed flat cavity consists of the base plate and the cover plate. The inner wall of the cavity is equipped with a liquid-absorbing capillary core structure. The capillary core structure can be a wire mesh, a micro groove, a fiber wire, or a metal powder sintered core and a composite combination of several structures. If necessary, a supporting structure must be provided inside the cavity to overcome deformation caused by negative vacuum pressure, heating and installation pressure. When heat is transmitted to the evaporation zone, the liquid phase vaporization will begin to occur in a low vacuum environment. At this time, the working fluid absorbs heat energy and the volume expands rapidly. The steam phase working fluid will quickly fill the entire cavity. When the steam phase working fluid comes into contact with a relatively cold area, a condensation phenomenon will occur. The heat accumulated during evaporation is released through the condensation phenomenon. The condensed liquid phase working fluid returns to the evaporation heat source through the capillary phenomenon of the microstructure. This operation will continue around the cavity. This is the operation of the temperature equalization plate. Also, since the microstructure of the working fluid can generate capillary forces when evaporates, the operation of the temperature uniform plate can be unaffected by gravity.
Product FAQ
Q1: What is a Temperature Equalization Board Module?
A: It's a thermal component used to evenly distribute heat across an electronic device or battery pack, helping prevent localized overheating and ensuring consistent operating temperatures.
Q2: How does it improve device performance?
A: By eliminating hotspots, it reduces the risk of thermal damage and increases system stability, which extends the operational life of your components.
Q3: Is it suitable for battery systems?
A: Yes. It's especially useful for lithium-ion battery packs where uneven temperature can cause capacity loss, safety issues, or reduced lifespan.
Q4: What materials are used in the module?
A: Typically made from graphite sheets, aluminum substrates, or other high thermal conductivity materials, depending on the thermal and structural requirements.
Q5: Can it be customized for specific applications?
A: Absolutely. We offer tailored solutions based on your product dimensions, operating environment, and heat dissipation needs.
Q6: How is it installed in a system?
A: The module can be installed between the heat source and the heat sink/fan using thermal adhesives, screws, or integrated clips. It’s designed for easy integration into various device layouts.
Q7: Is it compatible with active and passive cooling methods?
A: Yes. It can work with both passive components like heat sinks and active systems like fans or liquid cooling modules to enhance thermal efficiency.
Q8: What industries typically use this product?
A: Common industries include electric vehicles (EV), telecommunications, energy storage systems, consumer electronics, and industrial automation.
Product Introduction
The Temperature equalization board module is a high-performance thermal management component designed to uniformly distribute and balance heat across sensitive electronic components. Engineered for modern applications that demand consistent temperature control, this module effectively reduces hotspots, improves overall cooling efficiency, and enhances the long-term reliability of electronic devices.
Whether used in communication equipment, battery packs, power modules, or industrial electronics, the Temperature Equalization Board ensures stable thermal performance by spreading heat evenly across the entire module surface.
Key Features:
Uniform Heat Distribution – Eliminates temperature differences across the board, reducing thermal stress and increasing system stability.
Efficient Heat Conduction – Built with high thermal conductivity materials for quick and effective heat transfer.
Battery Protection – Ideal for lithium-ion battery packs and energy storage systems, balancing temperature during charging/discharging cycles.
Modular & Lightweight Design – Easy to integrate into compact systems without adding bulk.
Compatible with Various Cooling Systems – Works in conjunction with fans, heat sinks, and thermal pads.
Enhanced Equipment Lifespan – Prevents overheating and component degradation over time.
Typical Applications:
EV battery thermal management
Power modules and inverters
Communication base stations
Data centers and servers
Medical and industrial control devices
Product parameters
Specification:Maximum size: 400MMX 400MM
Thickness:1.0 mm (MM) or above
Work quality:Refrigerant
Microstructure:Multilayer fiber capillary structure, regionalized pore size design
Cavity material: oxygen-free copper (C1100/C1020)
External structure: oxygen-free copper (C1100/C1020
characteristic
Low starting temperature; fast heat transfer speed; good temperature averaging performance: large output power: low manufacturing cost; long service life and lighter.
Application scope
Especially suitable for cooling needs in narrow space environments where height space is strictly restricted. Such as laptops, computer workstations and network servers. It is very suitable for working environments where the temperature of the node is high and needs to be cooled quickly in step by step. For example, the heat dissipation of high-power LEDs, the heat dissipation of semiconductor refrigeration wafers and the thermal power generation, the temperature uniform plate, as a heat transfer element, can provide heat dissipation needs in the electronics industry and many other industries.
structure
A completely closed flat cavity consists of the base plate and the cover plate. The inner wall of the cavity is equipped with a liquid-absorbing capillary core structure. The capillary core structure can be a wire mesh, a micro groove, a fiber wire, or a metal powder sintered core and a composite combination of several structures. If necessary, a supporting structure must be provided inside the cavity to overcome deformation caused by negative vacuum pressure, heating and installation pressure. When heat is transmitted to the evaporation zone, the liquid phase vaporization will begin to occur in a low vacuum environment. At this time, the working fluid absorbs heat energy and the volume expands rapidly. The steam phase working fluid will quickly fill the entire cavity. When the steam phase working fluid comes into contact with a relatively cold area, a condensation phenomenon will occur. The heat accumulated during evaporation is released through the condensation phenomenon. The condensed liquid phase working fluid returns to the evaporation heat source through the capillary phenomenon of the microstructure. This operation will continue around the cavity. This is the operation of the temperature equalization plate. Also, since the microstructure of the working fluid can generate capillary forces when evaporates, the operation of the temperature uniform plate can be unaffected by gravity.
Product FAQ
Q1: What is a Temperature Equalization Board Module?
A: It's a thermal component used to evenly distribute heat across an electronic device or battery pack, helping prevent localized overheating and ensuring consistent operating temperatures.
Q2: How does it improve device performance?
A: By eliminating hotspots, it reduces the risk of thermal damage and increases system stability, which extends the operational life of your components.
Q3: Is it suitable for battery systems?
A: Yes. It's especially useful for lithium-ion battery packs where uneven temperature can cause capacity loss, safety issues, or reduced lifespan.
Q4: What materials are used in the module?
A: Typically made from graphite sheets, aluminum substrates, or other high thermal conductivity materials, depending on the thermal and structural requirements.
Q5: Can it be customized for specific applications?
A: Absolutely. We offer tailored solutions based on your product dimensions, operating environment, and heat dissipation needs.
Q6: How is it installed in a system?
A: The module can be installed between the heat source and the heat sink/fan using thermal adhesives, screws, or integrated clips. It’s designed for easy integration into various device layouts.
Q7: Is it compatible with active and passive cooling methods?
A: Yes. It can work with both passive components like heat sinks and active systems like fans or liquid cooling modules to enhance thermal efficiency.
Q8: What industries typically use this product?
A: Common industries include electric vehicles (EV), telecommunications, energy storage systems, consumer electronics, and industrial automation.
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