
Mr Yan
Leave a messageProduct Description
The TVapor chamber module consists of a vacuum-sealed metal cavity made of high thermal conductivity materials, filled with a working fluid. When heated, the fluid evaporates rapidly and condenses in cooler areas, enabling efficient phase-change-based heat spreading. The module can be customized in size, thickness, and thermal performance, and can be integrated with fans or other cooling elements.
Product Features
Ultra-high thermal conductivity for rapid heat transfer
Low thermal resistance and excellent temperature uniformity
Slim and lightweight design for compact spaces
High reliability and long lifespan
Customizable to meet customer requirements
Compatible with fan or heatsink integration
Product Functions
Effectively reduces operating temperatures
Eliminates hot spots for improved system stability
Supports heat dissipation of high-power chips
Extends the lifespan of electronic components
Reduces system noise (when used with fans)
Enhances overall thermal architecture
Application Fields
5G communication equipment
High-performance computing servers (HPC)
GPUs and graphic accelerator cards
Laptops and ultra-thin devices
Electric vehicle control units (ECU)
Medical electronic equipment
Industrial automation systems
High-brightness LED lighting systems
Product FAQ
Q1: What is the working principle of a vapor chamber module?
A: It uses phase change—evaporation and condensation—of a working fluid inside a vacuum chamber to rapidly spread heat from hot areas to cooler regions.
Q2: Is the TVapor Chamber Module suitable for high-power chips?
A: Yes, it is specifically designed for high-power density components and can efficiently manage heat for CPUs, GPUs, and ASICs.
Q3: Can the module be customized?
A: Absolutely. We offer full customization including size, thickness, mounting options, and thermal performance parameters.
Q4: How is it different from a traditional heatsink?
A: Traditional heatsinks rely on conduction only, while vapor chambers use phase change and offer much faster and more uniform heat spreading.
Q5: Does the TVapor Chamber require maintenance?
A: No, it is a sealed passive component with no moving parts, requiring no maintenance during its lifespan.
Q6: What environments is the module best suited for?
A: It’s perfect for compact devices with high heat flux such as laptops, base stations, and smart automotive electronics.
Product Description
The TVapor chamber module consists of a vacuum-sealed metal cavity made of high thermal conductivity materials, filled with a working fluid. When heated, the fluid evaporates rapidly and condenses in cooler areas, enabling efficient phase-change-based heat spreading. The module can be customized in size, thickness, and thermal performance, and can be integrated with fans or other cooling elements.
Product Features
Ultra-high thermal conductivity for rapid heat transfer
Low thermal resistance and excellent temperature uniformity
Slim and lightweight design for compact spaces
High reliability and long lifespan
Customizable to meet customer requirements
Compatible with fan or heatsink integration
Product Functions
Effectively reduces operating temperatures
Eliminates hot spots for improved system stability
Supports heat dissipation of high-power chips
Extends the lifespan of electronic components
Reduces system noise (when used with fans)
Enhances overall thermal architecture
Application Fields
5G communication equipment
High-performance computing servers (HPC)
GPUs and graphic accelerator cards
Laptops and ultra-thin devices
Electric vehicle control units (ECU)
Medical electronic equipment
Industrial automation systems
High-brightness LED lighting systems
Product FAQ
Q1: What is the working principle of a vapor chamber module?
A: It uses phase change—evaporation and condensation—of a working fluid inside a vacuum chamber to rapidly spread heat from hot areas to cooler regions.
Q2: Is the TVapor Chamber Module suitable for high-power chips?
A: Yes, it is specifically designed for high-power density components and can efficiently manage heat for CPUs, GPUs, and ASICs.
Q3: Can the module be customized?
A: Absolutely. We offer full customization including size, thickness, mounting options, and thermal performance parameters.
Q4: How is it different from a traditional heatsink?
A: Traditional heatsinks rely on conduction only, while vapor chambers use phase change and offer much faster and more uniform heat spreading.
Q5: Does the TVapor Chamber require maintenance?
A: No, it is a sealed passive component with no moving parts, requiring no maintenance during its lifespan.
Q6: What environments is the module best suited for?
A: It’s perfect for compact devices with high heat flux such as laptops, base stations, and smart automotive electronics.